26th European Microelectronics & Packaging Conference (EMPC 2027)

About this conference

26th European Microelectronics & Packaging Conference (EMPC 2027) is a conference on Engineering and Technology taking place on 14–16 September 2027 in Ingolstadt, Germany, organized by IMAPS Europe.

The 26th European Microelectronics & Packaging Conference (EMPC 2027) will take place from September 14–16, 2027 in Ingolstadt, Germany.

EMPC 2027 seeks original, non-commercial contributions presenting research and innovations in all areas of electronics packaging and system integration. Authors are invited to submit abstracts describing recent work, clearly outlining the objectives and demonstrating new results.

Conference topics include:
• Design, Modelling and Simulation: RF and microwave; thermal and thermomechanical; manufacturability and testability; electronic/photonic co-integration; 2.5D and 3D packages; chiplets.
• Materials and Processes: substrate and interposer technologies; interconnects; assembly and manufacturing; material characterisation; nanomaterials and nanotechnologies.
• Advanced Packaging and System Integration: heterogeneous integration; System in Package; wafer level packaging; photonics and co-packaged optics; MEMS, MOEMS and sensor packaging; RF and power packaging.
• Quality and Reliability: process control; inspection and testing; reliability testing; digital twins; failure analysis; lifetime prediction; long-term storage.
• Emerging Technologies: packaging for AI and HPC; quantum devices; sustainable electronics and circular economy; glass interposers; AI in electronics technology.

Abstract submission deadline: January 25, 2027. Maximum abstract length: 500 words, with up to two optional figures.

More information: https://empc2027.org/submissions/

Dates and details are provided by the organizer. Always confirm on the official website before registering or booking travel.