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28th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2027)

11–14 April 2027 Regensburg, Germany

Dates
11 April 2027 – 14 April 2027
Location
Regensburg, Germany
Venue
marinaforum Regensburg
Organizer
EuroSimE
Event type
Conference
Contact person
Martina Creutzfeldt
Listing ID
CI18556
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About this conference

28th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2027) is a conference on Engineering and Technology taking place on 11–14 April 2027 in Regensburg, Germany, organized by EuroSimE.

The 28th International Conference on Thermal, Mechanical and Multiphysics Simulation and Experiments in Microelectronics and Microsystems (EuroSimE 2027) will take place from April 11–14, 2027 in Regensburg, Germany.

EuroSimE addresses fundamental research and industrial applications related to thermal, mechanical and multiphysics simulation and experiments of micro- and nano-electronics and microsystems.

Topics include:
• Single Domain Simulation: thermal, mechanical and thermo-mechanical simulation; vibration and shock; chip-package-board interaction; numerical and analytical methods; compact modelling and model order reduction; digital twins; thermal management.
• Material Characterization and Validation: experiments and modelling; bulk and interface toughness; experimental validation; failure analysis; damage modelling for reliability prediction.
• Application Domains: electronic components, packaging and system integration; aerospace, automotive, energy, lighting and medical applications; MEMS sensors and actuators; opto-electronic and opto-mechanical devices; nano-electronic mechanical devices; consumer electronics.
• Multiphysics Simulation: multi-scale modelling; integrated process modelling; simulation-based optimization; virtual prototyping; heterogeneous integration.
• Emerging Modelling Methods and Tools: prognostics and health management; AI and machine learning; big data; 3D packaging and TSV technology; chiplet packaging; additive manufacturing for electronics.

Abstract submission deadline: October 26, 2026.
Notification of acceptance: December 17, 2026.
Full paper submission deadline: March 2, 2027.

More information: https://www.eurosime.org/submissions/

Dates and details are provided by the organizer. Always confirm on the official website before registering or booking travel.

Travelling to Regensburg for this event?

Visa: Germany is part of the Schengen Area.

Best time to travel: The busiest periods are March–June and September–November.

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