2026 12th International Conference on Mechanical Engineering, Materials and Automation Technology (MMEAT 2026)

About 2026 12th International Conference on Mechanical Engineering, Materials and Automation Technology (MMEAT 2026)

2026 12th International Conference on Mechanical Engineering, Materials and Automation Technology (MMEAT 2026) will be held in Beijing, China from June 5 to 7, 2026.

Conference Website: https://ais.cn/u/EfAzAr

---Call For Papers---
The topics of interest for submission include, but are not limited to:
◕Mechanical Automation
CNC technology and CNC system
Intelligent manufacturing technology
Test techniques and troubleshooting
Computer Integrated Manufacturing Systems (CIMS)
Molding manufacturing and automation
Instrument Science and Technology
Fluid Machinery and Engineering
Mechatronics
Automatic control and technology
Automated instrumentation and equipment
Factory modeling and automation
Circuits and systems
Communications and Information Systems
Electronic systems
Human-computer interaction and mechatronic engineering

◕Control, Automation and Information Technology
Control System Modeling and Simulation technology
Intelligent Optimization Algorithms and Applications
Fluid Power Transmission and Control
Production Process Simulation
Network Control
Electric Automation
Vehicle Control Systems
Computer Integrated Manufacturing
Microelectronics Technology
Embedded Systems
The Photoelectron IT and System
Intelligent Traffic Control
Computer System Structure

◕Advanced Materials
Nanomaterials and Nanotechnology
Semiconductor Materials and Devices
Electronic Packaging and Interconnection Technology
Flexible electronics and smart wearable devices
High Frequency Electronic Materials and Applications
Electronic ceramics and catalytic materials
Photoelectric materials and LED technology
Thermoelectric materials and thermal management
Technology Battery Technology and Energy Storage
New display technology and materials
Optoelectronics and Microelectronic Materials
Optoelectronic display materials
Semiconductor Materials and Semiconductor Lighting
Power Laser Materials and Devices
Advanced Packaging Materials and Technologies
Solar cell materials
Electromagnetic Compatibility Technology and Materials
Materials and Devices for High Frequency and Ultra High Frequency Communication

---Publication---
All papers will be reviewed by two or three expert reviewers from the conference committees. After a careful reviewing process, all accepted papers will be published in the Conference Proceedings, and submitted to EI Compendex, Scopus for indexing.

---Important Dates---
Full Paper Submission Date: April 22, 2026
Registration Deadline: May 29, 2026
Final Paper Submission Date: May 5, 2026
Conference Dates: June 5-7, 2026

--- Paper Submission---
Please send the full paper(word+pdf) to Submission System:
https://ais.cn/u/EfAzAr